Support & Resin Removal Solution
The PostProcess™ DEMI 200™ Support & Resin Removal solution offers the convenience of a compact bench-top footprint, designed to accommodate a few large or several small geometries. Its patent-pending technology ensures superior removal of PolyJet and FDM supports, as well as excess resin from SLA, DLP, and CLIP processes.
Equipped with the patented Submersed Vortex Cavitation (SVC) technology, the DEMI 200 employs a rotating motion within a fluid medium to effectively dispose of support material, providing uniform exposure to induced mechanical agitation. Integrated with proprietary software and paired with exclusive detergents, it precisely adjusts time and temperature based on the material and geometry of the 3D printed part, delivering a precise and hands-free post-printing solution for additively manufactured components.
Software Features |
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Hardware Features: |
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| Size and Weight | |
Envelope: | 18″ L x 10″ W x 6″ H (46 cm x 25 cm x 15 cm) |
Machine footprint: | 23.5” L x 18” W x 15.5” H (60 cm x 46 cm x 39 cm) Volume of parts should not exceed 2/3rds of envelope |
Weight: | 35 lbs. / 15 kg empty; 75 lbs. / 34 kg full |
| Detergent | |
Capacity: | 5 Gallons / 19 Liters |
Polyjet Materials: | PLM-101-SUB |
SLA, CLIP, and DLP Materials: | PLM-403-SUB |
טכנולוגיית הדפסת תלת מימד מחוללת מהפכה בתעשיות מרובות בכך שהיא אפשרה השגת מטרות מהירה, התאמה אישית וייצור חסכוני.
לסיכום: הרבגוניות והיעילות של הדפסת תלת מימד הופכות אותה לנכס בעל ערך על פני מגזרים מגוונים, מה שמניע חדשנות ומשפר את יכולות הייצור.
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