The PostProcess™ DEMI 200™ Support & Resin Removal solution offers the convenience of a compact bench-top footprint, designed to accommodate a few large or several small geometries. Its patent-pending technology ensures superior removal of PolyJet and FDM supports, as well as excess resin from SLA, DLP, and CLIP processes.

Equipped with the patented Submersed Vortex Cavitation (SVC) technology, the DEMI 200 employs a rotating motion within a fluid medium to effectively dispose of support material, providing uniform exposure to induced mechanical agitation. Integrated with proprietary software and paired with exclusive detergents, it precisely adjusts time and temperature based on the material and geometry of the 3D printed part, delivering a precise and hands-free post-printing solution for additively manufactured components.