Automated Support & Resin Removal
דף הבית » Post Process » PostProcess Technologies » DEMI 400
The PostProcess™ DEMI 400™ Series Support & Resin Removal submersion solutions deliver automated removal of PolyJet and FDM supports and excess resin for SLA, CLIP, and DLP technologies.
All versions in the DEMI 400 Series includes our patented Submersed Vortex Cavitation (SVC) technology – the system uses a rotating motion while the part is immersed in fluid and ensures even exposure to the induced mechanical agitation.
Utilizing our proprietary software and paired with our exclusive detergents, the right amount of time, and exact temperature based on the material and geometry of the 3D printed part, the DEMI 400 delivers precise, hands-free post-printing for additive manufacturing workflows.
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Electrical – Europe: | DEMI 430 Model (PolyJet/FDM/SLA/DLP/CLIP): Power: 230V, 50Hz, Connector: CEE 7/3, Dual agitation; includes heater & ultrasonics |
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Consumables: | All of our patent-pending engineered solutions have been developed for high-performance and optimized to use our exclusive media. We offer our media in 50 pound plastic containers with molded-in handles, for easy unload and storage. Our media has been formulated and tested to have the lowest attrition rates in the industry. |
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